• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method for repairing a printed circuit board (1) having at least one defective component (2) which is mechanically and / or electrically connected to the printed circuit board (1) via at least one printed circuit board side contact pad, the method comprising at least the following steps: removing the printed circuit board defective component (2) of the printed circuit board (1); Cleaning the at least one printed circuit board side contact point (3); Applying a solder paste (4) to the at least one cleaned board-side pad (3) by means of a Lotauftragsstempels (5), wherein the Lotauftragsstempel (5) first in a wetting step for wetting with the solder paste (4) in a reservoir (6) with solder paste ( 4) is at least partially discontinued and then the wetted Lotauftragsstempel (5) in a transfer step on the at least one desired printed circuit board side contact point (3) is deposited so that an application of the solder paste (4) on the at least one circuit board side contact point (3) is made possible ; Equipping the printed circuit board (1) with a replacement component (7) anticipated for the defective component (2); Soldering the replacement component (7).
    公开号:CH710588B1
    申请号:CH00607/16
    申请日:2014-09-30
    公开日:2018-05-15
    发明作者:Hippin Christoph；Schöne Jenny
    申请人:Endress Hauser Se Co Kg；
    IPC主号:
    专利说明:

    Description [0001] The invention relates to a method for repairing a printed circuit board having at least one defective component, a solder applicator stamp, a use of the solder applicator stamp and an automation system.
    From the PCB manufacturing various methods for mounting the circuit boards are known. For example, so-called SMD components (Surface Mounted Device) are mounted on contact surfaces on the front side of the printed circuit board. By contrast, THT components (through-hole technology) have connecting wires which are inserted through an opening in the printed circuit board and fastened on the opposite side of the printed circuit board. Here, a mixed assembly with SMD and THT components is possible. The soldering of SMD components is usually carried out in a reflow process. In preparation for this, the circuit board is provided at the points to be equipped with solder paste, which forms a Lotpastendepot. Subsequently, the component is positioned on the corresponding solder depot. The so-equipped printed circuit board is exposed to a heat source, for example, placed on a hot plate or supplied to a soldering oven, wherein the solder paste is melted and thereby a connection of the component is made with the circuit board.
    It may occur that components are faulty or fail during operation. In particular, in cost-intensive components or assemblies with a variety of components in such a case, not the complete assembly is disposed of, but replaced the faulty or defective component. When removing the component usually remains back solder, which is not sufficient as a solder paste depot for the attachment of the replacement component. As a result, a subsequent application of an individually determined amount of solder on the circuit board or the carrier or the component is required. Since the surfaces or the contact points to which the solder paste is to be applied are often very small, it is no longer possible to apply the solder paste by one of the conventional methods, such as stencil printing or solder paste printing. Since the openings required in the template for these methods are clearly too small, no solder paste or not enough solder paste can be released from the openings of the template and thus transferred to the pad or the contact point. Thus it is not possible to have contact points which, for example, have a dimension of 470 μm to 160 μm, with a conventional solder paste of the class Type 3 or also Type 4 because the spherical size of the solder paste of these classes is too large.
    An alternative to stencil printing or solder paste method is the dispensing technique by means of example. A syringe or cartridge, this method also pushes at these ball sizes to their limits. Typically, the diameters of the solder paste dispensers dispensed by this method are about 300 to 500 μm.
    Furthermore, it is known to print solder paste by means of jet printing contactless on the contact points. In this case, solder paste depots can be produced with a minimum diameter of about 300 pm. Smaller diameters are also difficult to realize with this technology.
    Also from the prior art it is known that components or their contact points, which are to be placed on a printed circuit board, immersed in a filled with flux and / or solder paste pan with a corresponding depth, so as to contact points with flux and / or solder paste to moisten. After the component has been pulled out of the trough, the contact points thus have flux and / or solder paste for the soldering process. However, this method only works for components that have protruding or protruding contact points, for example in the form of balls, pins, etc.
    The invention is therefore based on the object to enable the soldering of components that have no protruding or protruding contact points and the contact points additionally still have very small dimensions.
    The object is achieved by a method, a Lotauftragsstempel, a use of Lotauftragsstempels and an automation system.
    With regard to the method, the object is achieved by a method for repairing a printed circuit board with at least one defective component, wherein the defective component is mechanically and / or electrically connected via at least one printed circuit board side pad with the circuit board, wherein the method comprises at least the following steps : - removing the defective component from the circuit board; - Cleaning the at least one circuit board side contact point; - Applying a solder paste on the at least one cleaned circuit board side pad by means of a Lotauftragsstempels, wherein the Lotauftragsstempel is first at least partially deposited in a wetting step for wetting with the solder paste in a reservoir with solder paste and then deposited the wetted Lotauftragsstempel in a transfer font on the desired printed circuit board side contact point is, so that an application or transfer of the solder paste on the at least one printed circuit board side contact point is made possible; - Equipping the circuit board with a predicted for the defective component spare component; - Soldering of the replacement component.
    According to the invention, the object is achieved in that for applying the solder paste, a specially designed Lotauftragsstempel is used, via which the solder paste is transferred to the contact points of the circuit board so as to generate solder paste dummies from 10 pm to 300 pm.
    Another advantage of the inventive method is that it is also possible to bring solder paste in solder deposits, so wells that has the circuit board. This is only possible to a very limited extent with the conventional methods, such as stencil printing.
    Furthermore, the method offers increased flexibility, since it is not bound as in template printing to the production of a template necessary for the specific circuit board. In addition, smaller distances between two contact points to be wetted with solder paste can be realized with the method according to the invention.
    According to an advantageous embodiment, the method provides that the wetting step is performed force-controlled, so that the Lotauftragsstempel is sold only up to a predefined first force in the reservoir.
    According to a further advantageous embodiment, the method provides that the transfer step is performed force-controlled, so that the wetted Lotauftragsstempel is sold only up to a predefined second force on the at least one printed circuit board side contact point.
    According to a further advantageous embodiment, the method provides that the cleaning of the circuit board side contact points is performed without contact.
    With regard to the Lotauftragsstempels the object is achieved by a Lotauftragsstempel for transferring solder paste from a reservoir to a contact point of a printed circuit board, wherein the Lotauftragsstempel comprises: - body with an end face; - At least one projection which protrudes from the end face and having a projection surface, wherein the projection in longitudinal section has an at least partially concave contour between the end face and the projection surface.
    An advantageous embodiment of the Lotauftragsstempels provides that the projection surface extends substantially parallel to the end face of the base body.
    An advantageous embodiment of the Lotauftragsstempels provides that the protrusion surface is formed so that the ratio of the end face to the protruding surface a maximum of a factor 10, preferably a factor of 7.5, particularly preferably a factor of 5 corresponds.
    An alternative embodiment of the Lotauftragsstempels provides that the protrusion surface is formed so that the ratio of the end face to the protrusion surface maximally a factor 35, preferably a factor of 21, particularly preferably a factor of 15 corresponds.
    An advantageous embodiment of the Lotauftragsstempels provides that the maximum distance between the end face and the projection surface and thus the height of the projection in the range of 50-250 pm, preferably in the range of 80-150 pm, is located.
    An alternative embodiment of the Lotauftragsstempels provides that the maximum distance between the end face and the projection surface and thus the height of the projection in the range of 50-400 pm, preferably in the range of 180-220 pm, more preferably in the range of 280 -320 pm, lies.
    An advantageous embodiment of the Lotauftragsstempels provides that the projecting surface has a diameter in the range of 300-180 pm, preferably in the range of 180-130 pm, more preferably in the range of 130-50 pm.
    A further advantageous embodiment provides that the solder applicator stamp further comprises a hydrophobic coating, which is applied at least in a region adjacent to the projection on the base body.
    With regard to use, the object is achieved by using the Lotauftragsstempels according to one of the previous embodiments for repairing a printed circuit board with at least one defective component.
    With regard to the automation system, the object is achieved by an automation system for repairing a printed circuit board having at least one defective component, wherein the automation system comprises at least: - a Lotauftragsstempel, as described in one of the previous embodiments; an automatic positioning unit to which the solder applicator stamp is attached so as to enable automatic positioning of the solder applicator stamp; a board receiving unit which allows automatic positioning of a printed circuit board mounted in the board receiving unit with respect to the positioning unit.
    An advantageous embodiment of the automation system according to the invention provides that the positioning unit enables a force-controlled method, in particular a force-controlled setting down of the soldering application stamp fastened to the positioning unit.
    The invention will be explained in more detail with reference to the following drawings. It shows:
    1 shows a flow chart of the inventive method,
    2 shows a schematic representation to illustrate the procedure,
    3: a schematic representation of the inventive solder applicator stamp, and
    4 shows a schematic representation of the bottom view of the solder applicator stamp according to the invention.
    FIG. 1 shows a flow chart of the method according to the invention. In the first step, the defective component 2, which is mechanically and / or electrically attached to the printed circuit board 1 via contact points 3, is removed. For this purpose, the circuit board 1 is clamped in an automation system, which has a circuit board receiving unit. Preferably, the board receiving unit comprises a sub-heater, which allows a preheating of the entire circuit board 1. To remove the still soldered to the circuit board 1 defective component 2, the automation system is equipped with a multi-channel annular nozzle. The multi-channel annular nozzle is designed such that they can deliver hot air on the one hand and on the other hand can draw vacuum or air. In this way, the solder between the contact points 3 of the defective component 2 and the contact points 3 of the circuit board 1 can be melted by means of hot air. The size of the multi-channel annular nozzle is dependent on the component size and chosen so that a substantially complete heating of the defective component 2 and the contact points 3 takes place. After the solder 4 has been melted, the defective component 2 is sucked in by means of the vacuum function of the multi-channel annular nozzle and the component 2 is removed from the printed circuit board 1.
    Preferably, it is provided in an intermediate step that is waited before further processing of the circuit board 1 until the automation system and thus the circuit board 1 is cooled. Alternatively, the circuit board 1 can be further processed in an already cooled second automation system.
    In the second step, all the board-side contact points 3, which have served to connect the defective component 2 to the circuit board 1, cleaned. Preferably, this cleaning is satisfied contactless. For this purpose, the automation system is equipped with a multi-channel cleaning nozzle. The multi-channel cleaning nozzle is again designed such that on the one hand can deliver hot air and on the other hand can draw a vacuum or air, wherein the sucked air is passed through a bypass via a filter. By means of the multi-channel cleaning nozzle, the contact points 3 are traversed, wherein the remaining solder, which is still present after the removal of the defective component 2, is heated by the hot air in order to subsequently remove it.
    In the third step, a solder paste 4 is applied to the cleaned board-side contact points 3. For this purpose, the automation system is equipped with a Lotauftragsstempel 5, which serves for the transfer or transfer of the solder paste 4 from a reservoir 8 to the contact point 3. Subsequently, the Lotauftragsstempel 5 is driven by a positioning of the automation system via the reservoir 6 and deposited in the reservoir 6 at least partially, so that a wetting of Lotauftragsstempels 5 takes place. In this case, the solder applicator stamp 5 is deposited into the reservoir 6 only up to a predefined first force, for example 1 N. Following this, the solder applicator stamp 5 wetted with solder paste 4 is moved again from the reservoir 6 to a predetermined position on the printed circuit board 1, on which the replacement component 7 is provided. At the fixed or predefined position, the solder applicator stamp 5 is deposited on the printed circuit board-side contact point 3, for example a copper pad, so that the solder paste 4 is applied or transferred to the contact point 3. Here, the Lotauftragsstempel 5 with a predefined second force, for example. OJN, placed on the contact point 3. The positioning of the automation system moves the Lotauftragsstempel 5 force-controlled, i. the force acting on the contact point 3 when placing or pressing on the solder application stamp 5 is controlled by the positioning unit and in the event that the acting force exceeds a predefined (first and / or second) force, the settling process is stopped or stopped.
    For example, a dip trough having a defined depth can serve as the reservoir 6. In the dip pan 6, the solder paste 4 is introduced and then removed the excess solder paste 4 by means of a doctor blade. In this way, a very reproducible amount of solder paste 4 in the reservoir 6 or the dip well can be realized. In addition, the reservoir or the dip trough 6 can have a nano-coating, so as to enable a simpler detachment of the solder paste 4.
    In the event that several contact points 3 are to be provided with solder paste 4, the third step is repeated several times or it is a Lotauftragsstempel 5 is used, which can wet several contact points 3 at the same time.
    In the fourth step, the printed circuit board 1 is equipped with a replacement component 7 provided for the defective component 2. In this case, the multi-channel annular nozzle already used in the first step is used to extract the replacement component 7 from a component belt and to convey it to the desired position on the printed circuit board 1.
    In the fifth step, the previously placed on the circuit board 1 spare component 7 is soldered. In this case, the replacement component 7 placed on the preheated printed circuit board 1 is soldered to the printed circuit board 1 by means of the hot air function of the multichannel annular nozzle.
    权利要求:
    Claims (14)
    [1]
    Fig. 2 shows a schematic representation to illustrate the process flow. In this case, a printed circuit board 1 with three components is shown by way of example in FIG. 2a, the left-hand component 2 being defective. This defective component 2 is removed according to the first step described above. Fig. 2b shows the circuit board 1, in which the defective component 2 is removed and the circuit board side contact points 3 are cleaned. Fig. 2c shows the circuit board 1, in which the solder paste 4 is applied to the contact points 3. 2d shows the printed circuit board 1 with the soldered replacement component 7. FIG. 3 shows a schematic representation of the solder application stamp 5 according to the invention. This has a main body 8 with an end face As. From the end face As, a protrusion 9 projects, which has a protrusion surface Av, which preferably runs essentially parallel to the end face As of the base body 8. The projection 9 is designed in such a way that, in longitudinal section, it has an at least partially concave contour 10 between the end face As and the projection surface Av. About the concave contour 10 takes the Lotauftragsstempel 5 when it is placed or brought into a reservoir 6, the solder paste 4. The maximum distance D of the projection surface Av of the projection 9 to the end face As of the base body 8 is in the range of 50-400 pm, preferably in the range of 80-150 pm. Particularly suitable is a maximum distance of about 300 pm has been found. The maximum distance D is selected such that the end face As of the main body 8 wets with solder paste 4, when the Lotauftragsstempel 5 is deposited in the reservoir 6, that the projecting surface As touches the bottom of the reservoir 6. As already mentioned, for example, a dip trough serving as reservoir 6 may have a depth in the range from 700 μm to 400 μm, preferably in the range from 400 μm to 200 μm, particularly preferably in the range from 200 μm to 40 μm. having. Fig. 4 shows a schematic representation of the bottom view of the inventive Lotauftragsstempels 5. The face As is square. Conceivable, however, are other geometric shapes, such as. A round cross-section. The projection 9 and thus also the projection surface As are formed such that they have a round cross-section. The cross-sectional area of the projection 9 decreases steadily from the end face As, towards the projection surface Av. In addition to a round cross-section but other geometric shapes, in particular rectangular or square cross-sectional shapes, conceivable. The cross-sectional area of the substantially square base body 8 has an area which is in the range from 0.16 mm 2 to 0.64 mm 2, preferably in the range from 0.64 mm 2 to 1 mm 2, particularly preferably in the range from 1 mm 2 to 2.25 mm2, lies. The diameter of the projection surface Av, depending on the contact point to be wetted, is in the range of 300-180 μm, preferably in the range of 180-130 μm, particularly preferably in the range of 130-50 μm. Furthermore, the solder applicator stamp shown in Fig. 3 comprises a hydrophobic coating (11) which is applied at least on a part of the surface of the base body (8). As can be seen from FIG. 3, the base body is provided with the hydrophobic coating at least in the region adjacent to the projection. The hydrophobic coating can continue to extend over the entire body up to the side facing away from the end face of the body. Furthermore, it has been found that it is advantageous if the bottom of the reservoir or the dip tank is also provided with a hydrophobic coating. Such a trained Lotauftragsstempel 5 can be used in the repair of a printed circuit board 1 with at least one defective component 2, wherein the component 2 at least one contact surface 3 with a maximum dimension of 500 pm to 200 pm, preferably a maximum dimension of 470 pm at 160 pm. Advantageously, the Lotauftragsstempel 5 can be used in the repair of a printed circuit board 1 with at least one defective component 2, wherein the component 2 has at least two contact surfaces, wherein the contact points 3 a distance of 175 pm, preferably 150 pm, more preferably from 125 pm. claims
    1. A method for repairing a printed circuit board (1) having at least one defective component (2) which is mechanically and / or electrically connected to the printed circuit board (1) via at least one printed circuit board-side contact pad (3), the method comprising at least the following steps: - removing the defective component (2) from the printed circuit board (1); - Cleaning the at least one printed circuit board side contact point (3); - Applying a solder paste (4) on the at least one cleaned circuit board side contact point (3) by means of a Lotauftragsstempels (5), wherein the Lotauftragsstempel (5) first in a wetting step for wetting with the solder paste (4) in a reservoir (6) with solder paste (4) is at least partially discontinued and then the wetted Lotauftragsstempel (5) in a transfer step on the at least one desired printed circuit board side contact point (3) is deposited, so that an application of the solder paste (4) on the at least one circuit board side contact point (3) , whereby solder paste deposits with a diameter of 10 pm to 300 pm are generated; - Equipping the circuit board (1) with a for the defective component (2) anticipated replacement component (7); - Soldering the replacement component (7).
    [2]
    2. The method of claim 1, wherein the wetting step is carried out force-controlled, so that the Lotauftragsstempel (5) is deposited only up to a predefined first force in the reservoir (6).
    [3]
    3. The method of claim 1 or 2, wherein the transfer step is carried out force-controlled, so that the wetted Lotauftragsstempel (5) only to a predefined second force on the at least one printed circuit board side contact point (3) is discontinued.
    [4]
    4. The method according to any one of claims 1 to 3, wherein the cleaning of the circuit board side contact points (3) is performed without contact.
    [5]
    5. Lotauftragsstempel (5) for transferring solder paste (4) from a reservoir (6) to a contact point (3) of a printed circuit board (1) according to the method of one of claims 1 to 4, wherein the Lotauftragsstempel (5) comprises: - Basic body (8) with an end face (As); at least one protrusion (9) protruding from the end face (As) and having a protrusion surface (Av), wherein the protrusion (9) in longitudinal section has an at least partially concave contour (10) between the end face (As) and the protrusion surface (11) Av), wherein the maximum distance (D) between the end face (As) and the projection surface (Av) and thus the height of the projection (9) in the range of 50-400 pm and the protrusion surface has a diameter in the range of 300- 180 pm, preferably in the range of 180-130 pm, particularly preferably in the range of 130-50 pm.
    [6]
    6. Lotauftragsstempel according to claim 5, wherein the projection surface (Av) substantially parallel to the end face (As) of the base body (8).
    [7]
    7. Lotauftragsstempel according to claim 5 or 6, wherein the projection surface (Av) is formed so that the ratio of the end face (As) to the projecting surface (Av) a maximum of a factor 10, preferably a factor of 7.5, particularly preferably a factor of 5 , corresponds.
    [8]
    8. Lotauftragsstempel according to claim 5 or 6, wherein the projection surface (Av) is formed so that the ratio of the end face (As) to the projecting surface (Av) a maximum of a factor 35, preferably a factor of 21, particularly preferably a factor of 15 corresponds ,
    [9]
    9. Lotauftragsstempel according to any one of claims 5 to 8, wherein the maximum distance (D) between the end face (As) and the projecting surface (Av) and thus the height of the projection in the range of 50-250 pm, preferably in the range of 80- 150 pm, lies.
    [10]
    10. Lotauftragsstempel according to one of claims 5 to 8, wherein the maximum distance (D) between the end face (As) and the projecting surface (Av) and thus the height of the projection (9) in the range of 180-220 pm, preferably in the range from 280-320 pm.
    [11]
    11. Lotauftragsstempel according to one of claims 5 to 10, further comprising a hydrophobic coating (11), which is applied at least in one of the projection (9) adjacent region (12) on the base body.
    [12]
    12. Use of a Lotauftragsstempels according to one of claims 5 to 10 in an automation system for repairing a printed circuit board (1) having at least one defective component (2).
    [13]
    13. automation system for repairing a printed circuit board (1) having at least one defective component (2), according to the method according to one of claims 1 to 4, comprising: - a Lotauftragsstempel (5), as in one of claims 5 to 11 is described; - An automatic positioning to which the Lotauftragsstempel (5) is mounted, so as to enable an automatic positioning or method of the Lotauftragsstempels (5); a board receiving unit that allows automatic positioning of a printed circuit board (1) inserted in the board receiving unit with respect to the positioning unit; - A multi-channel annular nozzle for removing a still soldered to the circuit board (1) defective component (2), for extracting a replacement component (7) from a component belt, for conveying the replacement component (7) to a desired position on the circuit board ( 1) and for soldering the placed replacement component (7) to the printed circuit board (1), wherein the multi-channel annular nozzle is designed such that it can deliver hot air on the one hand and air to the other; - A multi-channel cleaning nozzle for driving off contact points (3) on the circuit board (1) and heating of residual solder on the circuit board (1), wherein the multi-channel cleaning nozzle is designed such that they give off a hot air and pull to the other air can.
    [14]
    14. The automation system according to claim 13, wherein the positioning unit enables a force-controlled method, in particular a force-controlled setting down of the soldering application stamp (5) fastened to the positioning unit.
    类似技术:
    公开号 | 公开日 | 专利标题
    CH710588B1|2018-05-15|Method for repairing a printed circuit board with at least one defective component.
    EP0487782A1|1992-06-03|Method of soldering circuit boards
    WO2008012165A9|2008-05-08|Method and wave soldering system for soldering components onto the top and bottom surface of a circuit board
    DE102019118574A1|2021-01-14|Pen for transferring solder paste from a reservoir to a contact point on a circuit board
    EP1889338A1|2008-02-20|Plug-in contact element, method for the production thereof, and device for carrying out said method
    DE19744455A1|1998-04-16|Device for forming flat pad suction surface on electronic components for suction pipette handling
    DE19854036A1|2000-05-18|Applying pasty media e.g. adhesive, solder paste, conductive glue etc. to circuit board by transmitting vibration from squeegee to pasty medium
    EP2009673B1|2011-03-02|Method for manufacturing fluid layers with pre-determined thickness on a framework
    EP3648921B1|2021-09-01|Method for cleaning a soldering nozzle of a soldering system
    DE19908625A1|2000-08-31|Device and method for applying adhesive material to flat components and its use
    DE102014118612A1|2016-07-21|Method for producing a solder joint
    DE102010033193A1|2012-02-09|Screen printing machine and screen printing process for the production of circuit boards for the electrical industry
    DE102015120185A1|2017-05-24|A method and apparatus for selecting a paste stencil for paste printing and for applying paste to a substrate using the selected paste stencil
    DE2935082A1|1981-03-19|Applicator bonds chips to integrated circuit substrates - by using presses to apply blobs of adhesive at desired places
    DE102018132056A1|2020-06-18|Process for manufacturing a printed circuit board and printed circuit board
    WO2021004751A1|2021-01-14|Method for removing a component applied to a printed circuit board
    DE102015214941A1|2017-02-09|Cleaning assembly for an electrical assembly and method for cleaning an electrical assembly
    DE102019218158A1|2021-05-27|SMD component and method for assembling an SMD component
    DE112004002603B4|2010-06-17|Method and device for soldering components on printed circuit boards by means of solder preforms
    DE102016220678A1|2018-04-26|Printing device and printing method for applying a viscous or pasty material
    DE3223910A1|1983-12-29|Device and process for the transfer of amounts of adhesive for the assembly of printed circuit boards with chip components
    DE3914462C2|2000-05-25|Method for mounting electronic components on a printed circuit board
    DE60317035T2|2008-07-31|Shielding cover for shielding electronic components on a printed circuit board
    WO2009024583A1|2009-02-26|Method for assembling electrical components equipped with terminal pins on a printed circuit board
    DE10134379A1|2003-01-30|Method for establishing an electrical connection between a plug element and a printed circuit board
    同族专利:
    公开号 | 公开日
    CN105830545B|2019-08-20|
    DE102013112348A1|2015-05-13|
    CN105830545A|2016-08-03|
    WO2015067413A1|2015-05-14|
    US20160353583A1|2016-12-01|
    US10237982B2|2019-03-19|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE2134195C3|1971-07-09|1974-01-24|Philips Patentverwaltung Gmbh, 2000 Hamburg|Device for applying solder paste to solder points|
    NL8304185A|1983-12-06|1985-07-01|Philips Nv|STAMP AND DEVICE FOR APPLYING DROPS OF A VISCOUS LIQUID ON A SUBSTRATE.|
    JPH03167891A|1989-11-28|1991-07-19|Fujitsu Ltd|Paste supplying method|
    DE19513366A1|1995-04-08|1996-10-10|Werner Hermann Wera Werke|Screwdriver, screwdriver bit or the like|
    US5676305A|1996-04-18|1997-10-14|Motorola, Inc.|Method to achieve regulated force contact in pin transfer deposition of liquidus substances|
    US5909839A|1997-05-15|1999-06-08|Ford Motor Company|Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins|
    US5951480A|1997-09-29|1999-09-14|Boston Scientific Corporation|Ultrasound imaging guidewire with static central core and tip|
    US6193143B1|1998-08-05|2001-02-27|Matsushita Electric Industrial Co., Ltd.|Solder bump forming method and mounting apparatus and mounting method of solder ball|
    DE19910173C2|1999-02-24|2003-07-03|Siemens Ag|Process for removing solder residues on a printed circuit board|
    DE102007013326A1|2007-03-20|2008-09-25|Linde Ag|Apparatus and method for pre-treatment of electronic components before soldering|
    DE102007041960B3|2007-09-03|2009-05-20|Siemens Ag|Replacing a component e.g. optical component fastened on support e.g. electrical printed circuit board by replacement module using thermally meltable composite material, comprises heating the composite material in the area of the component|
    CN101961825A|2009-07-23|2011-02-02|鸿富锦精密工业（深圳）有限公司|Method for maintaining mainboard|CN107567200B|2017-09-22|2019-09-06|广州兴森快捷电路科技有限公司|Board pads restorative procedure|
    US10881007B2|2017-10-04|2020-12-29|International Business Machines Corporation|Recondition process for BGA using flux|
    US10780515B2|2018-04-26|2020-09-22|Raytheon Technologies Corporation|Auto-adaptive braze dispensing systems and methods|
    DE102019118573A1|2019-07-09|2021-01-14|Endress+Hauser SE+Co. KG|Method for removing a component attached to a printed circuit board|
    DE102019118574A1|2019-07-09|2021-01-14|Endress+Hauser SE+Co. KG|Pen for transferring solder paste from a reservoir to a contact point on a circuit board|
    法律状态:
    2018-02-28| PFA| Name/firm changed|Owner name: ENDRESS+HAUSER SE+CO. KG, DE Free format text: FORMER OWNER: ENDRESS+HAUSER GMBH + CO. KG., DE |
    2020-09-30| PFA| Name/firm changed|Owner name: ENDRESS+HAUSER SE+CO. KG, DE Free format text: FORMER OWNER: ENDRESS+HAUSER SE+CO. KG, DE |
    优先权:
    申请号 | 申请日 | 专利标题
    DE201310112348|DE102013112348A1|2013-11-11|2013-11-11|Method for repairing a printed circuit board with at least one defective component|
    PCT/EP2014/070938|WO2015067413A1|2013-11-11|2014-09-30|Method for repairing a circuit board having at least one defective component|
    [返回顶部]